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 Model RFP-375375N6Z50-2 Aluminum Nitride Terminations
Aluminum Nitride SMD Terminations
30 Watts, 50
General Specifications
Resistive Element: Substrate: Terminals: Thick film Aluminum nitride ceramic Tin/Lead, 90/10 over nickel
Electrical Specifications Features
* DC - 2.0 GHz * 30 Watts * Aluminum Nitride (AlN) Ceramic * Surface Mountable * Non-Nichrome Resistive Element * Low VSWR * 100% Tested
Resistance Value: Frequency Range: Power: V.S.W.R.: 50 ohms, 2% DC - 2.0 GHz 30 Watts 1.25:1
Notes: Tolerance is .010, unless otherwise specified. Operating temperature is -55C to +125C (see chart). Designed to meet or exceed applicable portions of MIL-E-5400. All dimensions are in inches. Specifications subject to change without notice.
Outline Drawing
SIDE VIEW .060 TOP VIEW .375 BOTTOM VIEW
RFP ZN XXX
.100 .175
Note: XXX denotes value.
.375 .040 .040 .100
.175 HATCHED AREA INDICATES LOCATION OF PROTECTIVE COATING
VER. 12/5/01
Available on Tape and Reel for Pick and Place Manufacturing.
Sales Desk USA: Voice: (800) 544-2414 Fax: (315) 432-9121 Sales Desk Europe: Voice: (+44) 23 92 232392 Fax: (+44) 23 92 251369
1
Model RFP-375375N6Z50-2
% OF RATED POWER
Aluminum Nitride SMD Terminations
2
Typical Performance
Power Derating
Suggested Mounting Procedures
SCREW (2 PLS.)
100 75 50 25 0 25 50 75 100 125
SOLDER PASTE
PC BOARD HEATSINK
SOLDER FILLED VIA
1. Solder part in place using 60/40 type solder with controlled temperature iron (700F). 2. Drill thermal vias through PCB and fill with solder, such as 60/40 type. 3. To ensure good thermal connectivity to heat sink, drill and tap heatsink and mount PCB board to heat sink using screws.
P.C.B. SOLDER INTERFACE TEMPERATURE -- C
Available on Tape and Reel for Pick and Place Manufacturing.
Sales Desk USA: Voice: (800) 544-2414 Fax: (315) 432-9121 Sales Desk Europe: Voice: (+44) 23 92 232392 Fax: (+44) 23 92 251369


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