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Model RFP-375375N6Z50-2 Aluminum Nitride Terminations Aluminum Nitride SMD Terminations 30 Watts, 50 General Specifications Resistive Element: Substrate: Terminals: Thick film Aluminum nitride ceramic Tin/Lead, 90/10 over nickel Electrical Specifications Features * DC - 2.0 GHz * 30 Watts * Aluminum Nitride (AlN) Ceramic * Surface Mountable * Non-Nichrome Resistive Element * Low VSWR * 100% Tested Resistance Value: Frequency Range: Power: V.S.W.R.: 50 ohms, 2% DC - 2.0 GHz 30 Watts 1.25:1 Notes: Tolerance is .010, unless otherwise specified. Operating temperature is -55C to +125C (see chart). Designed to meet or exceed applicable portions of MIL-E-5400. All dimensions are in inches. Specifications subject to change without notice. Outline Drawing SIDE VIEW .060 TOP VIEW .375 BOTTOM VIEW RFP ZN XXX .100 .175 Note: XXX denotes value. .375 .040 .040 .100 .175 HATCHED AREA INDICATES LOCATION OF PROTECTIVE COATING VER. 12/5/01 Available on Tape and Reel for Pick and Place Manufacturing. Sales Desk USA: Voice: (800) 544-2414 Fax: (315) 432-9121 Sales Desk Europe: Voice: (+44) 23 92 232392 Fax: (+44) 23 92 251369 1 Model RFP-375375N6Z50-2 % OF RATED POWER Aluminum Nitride SMD Terminations 2 Typical Performance Power Derating Suggested Mounting Procedures SCREW (2 PLS.) 100 75 50 25 0 25 50 75 100 125 SOLDER PASTE PC BOARD HEATSINK SOLDER FILLED VIA 1. Solder part in place using 60/40 type solder with controlled temperature iron (700F). 2. Drill thermal vias through PCB and fill with solder, such as 60/40 type. 3. To ensure good thermal connectivity to heat sink, drill and tap heatsink and mount PCB board to heat sink using screws. P.C.B. SOLDER INTERFACE TEMPERATURE -- C Available on Tape and Reel for Pick and Place Manufacturing. Sales Desk USA: Voice: (800) 544-2414 Fax: (315) 432-9121 Sales Desk Europe: Voice: (+44) 23 92 232392 Fax: (+44) 23 92 251369 |
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